Hersteller: | Multicore |
---|---|
Produktkategorie: | Solder |
Datenblatt: | 1354298 |
Beschreibung: | 63S4 WS200 ACP 500G JAR |
RoHS-Status: | RoHS-konform |
Attribut | Attributwert |
---|---|
Hersteller | Multicore |
Produktkategorie | Solder |
Form | Jar, 17.64 oz (500g) |
Typ | Solder Paste |
Serie | WS200™ |
Prozess | Leaded |
Durchmesser | - |
Flux-Typ | Water Soluble |
Haltbarkeit | 6 Months |
Drahtmessgerät | - |
Zusammensetzung | Sn63Pb37 (63/37) |
Teilstatus | Not For New Designs |
Schmelzpunkt | 361°F (183°C) |
Versandinfo | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Shelf Life Start | Date of Manufacture |
Lager-/Kältetemperatur | 32°F ~ 50°F (0°C ~ 10°C) |
Refrence Preis ($) | 1 pcs | 100 pcs | 500 pcs |
---|---|---|---|
$72.42 | $70.97 | $69.55 |